Home> Industry Information> Mediatek Q2 Revenue 60 Billion 480 Million Ntd Beyond Expectations: Helio P60 Meritorious Service
Form: laoyaoba.com 2018/7/12 Browse:6073 Keywords: Helio P60
According to Taiwan media reports, a few days ago, the MediaTek announced its revenue in June, with a monthly revenue of 21 billion 60 million yuan. Accumulating 110 billion 135 million yuan in the first 6 months, NT $3.53%.
In addition, the company's second quarter revenue was over 60 billion, reaching NT $60 billion 480 million (about $1 billion 980 million), an increase of 21.8%, more than the company's previous forecast of 55 billion 600 million to 59 billion 600 million yuan.
It is understood that the two quarter of the joint development performance is positive, benefited from the demand season for mobile chips, and Helio P60 chips have been adopted by many mainland smartphones.
Helio P60 first started in the MWC exhibition in February this year, based on TVL 12NM technology, using 8 core Big.Little architecture design, four Cortex A73 big core and four Cortex A53 small core, both the highest primary frequency can reach 2.0GHz, CPU performance enhancement 70% (relative P23).
In addition, the chip integrated Mali-G72 MP3 GPU frequency 800MHz, the performance increased by 70% (relative P23). The maximum support 8GB capacity of LPDDR4X-1800 memory, Flash support the highest eMMC 5.1 and UFS 2.1. At the same time, integrated Edge AI platform artificial intelligence unit APU (AI processing unit) is integrated. Its comprehensive performance is close to the 660.
Looking forward to the third quarter, the Department maintains an optimistic forecast, but there are also people in the industry that the mainland smartphone market continues to fall into the downturn, and OPPO and other major factories are deliberately dispersing risks, dividing a part of the order into high Qualcomm, in order to inhibit the growth of the coalition. But in the long run, in addition to mobile chips, the MediaTek will continue to grow steadily in the fields of Wi-Fi, power management IC, vehicle electronics and Internet of things.